颜色
 Color

绿色

Green

粘度（主剂）
 Viscosity(main agent)

25℃,粘度计/Brookfield Viscometer DV2T

400±20dPa.s

混合比例
 Mixing ratio

主剂：硬化剂=65:35
 Main agent: Hardener=65:35

混合后使用期限
 Pot life after mixing

24小时（25℃以下暗处保存）

24hours(Store in dark place below 25℃)

保存期限
 Shelf life

制造后6个月
 6 months after production

附着力
 Adhesion

100/100

铅笔硬度)
 Hardness

6H

耐溶剂性
 Solvent resistence

PGM-AC，室温下浸泡30min后，以3M胶带做拉力测试，无油墨脱落
 PGM-Ac immersion 30 min at room temperature, no peel off after tape test.

耐酸性
 Acid resistance

10vol%H₂SO₄（aq），室温下浸泡30min后，以3M胶带做拉力测试 ，无油墨脱落
 10vol%H₂SO₄ immersion 30  min at room temperature, no peel off  after tape test.

耐碱性
 Alkaline resistance

10wt%NaOH(aq)，室温下浸泡30min后，以3M胶带做拉力测试，无油墨脱落
 10 wt% NaOH immersion 30 min at room temperature,  no peel off after tape test.

耐焊锡
 Solder resistance

260℃×10sec×3times

绝缘电阻

Insulation resistance

≥1.2×10¹¹Ω

包装
 Potting

1kg/套，4kg/套
 1kg/set，4kg/set

调油

Mixing

主剂和固化剂混合后搅拌5-10min，静置10min以上再使用

Stir 5-10min after the main agent and hardener mixing, hold 10min or more  before using

Printing for plug hole

前处理Pretreat

酸洗→磨刷→喷刷→高压水洗→水洗→烘干
 金刚砂浓度：18-22%
 酸洗H₂SO₄浓度：3%-5%

Acid washing→Scrubbing→Spray brush→High pressure water washing,→Rinsing→Drying

Emery concentration: 18-22%
 H₂SO₄ concentration: 3%-5%

磨痕测试：12-18mm
 水破测试：≧30s
 喷痕测试：同板面不同位置喷嘴堵塞≤5个

The grinding mark  test: 12 to 18 mm
 The water break test: ≧ 30 s
 Spray mark test: with different location of the nozzle  clogging ≤5

丝印

Screen printing

塞孔铝片：铝片厚度0.3mm

刮刀：厚度20mm，硬度70度

Plug hole aluminum thickness:  0.3mm

Squeegee thickness :20mm, hardness:  70degree

丝印完成后静置10min以上再进行预烤

Recommend to hold 10 minutes before prebaking

预烤

Pre curing

双面烘干：75℃×35-45min

Double-sided：75℃×35-45min

预烤后静置15min以上再进行曝光，静置时间不可超过24hr. Hold above 15min , but no more than 24hr after prebaking

曝光Exposure

600～800mJ/ cm²，21级曝光尺：10-13格盖膜

600～800mJ/ cm²，Stouffer  21 steps :10-13steps cover coating

曝光后静置15min以上再进行显影，静置时间不可超过24hr. Hold above 15min , but no more than 24hr after exposure

显影Developing

Na₂CO₃浓度：0.8-1.2%     
 温度：28-32℃
 喷淋压力：1.5-2.0kg/cm²
 时间：55-70sec
 PH值：9-11

Na₂CO₃ concentration: 0.8-1.2%

Temperature: 28-32℃

Spray pressure: 1.5-2.0kg/cm²

Time: 55-70sec

PH value: 9-11

A.上喷淋比下喷淋压力大0.2kg/cm2可以预防卡板
 B.显影点控制：50-60%

A. The above spray pressure is larger than the below spray  pressure 0.2kg/cm2 can prevent the plug board
 B. Developing point control: 50-60%

后烤

Final curing

 65-170℃×16-18仓,时间70-180分钟。

65-170℃×16-18 oven, time：70-180 minutes.

如塞孔板或厚铜板要求先低温分段烤后再高温固化

A plug hole or thick copper of PCB request five sections of baking at low  temperature before high temperature curing